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Pressure-sensitive adhesive tape for flexible printed circuit

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Pressure-sensitive adhesive tape for flexible printed circuit


The present invention provides a pressure-sensitive adhesive tape for a flexible printed circuit, from which a release liner can be released without being torn off even after being subjected to a high temperature process such as a solder reflow process. The pressure-sensitive adhesive tape of the present invention includes: a pressure-sensitive adhesive layer; and a release liner on at least one surface of the pressure-sensitive adhesive layer, wherein a tensile strength of the release liner in a machine direction is 50 MPa to 150 MPa, and a tensile strength of the release liner in a machine direction after heating at 280° C. for 5 min is 20 MPa to 120 MPa.

Browse recent Nitto Denko Corporation patents - Osaka, JP
Inventors: Hakaru HORIGUCHI, Noritsugu DAIGAKU, Takahiro NONAKA, Rie KUWAHARA
USPTO Applicaton #: #20120270002 - Class: 428 415 (USPTO) - 10/25/12 - Class 428 
Stock Material Or Miscellaneous Articles > Layer Or Component Removable To Expose Adhesive >Polymer Derived From Material Having At Least One Acrylic Or Alkacrylic Group Or The Nitrile Or Amide Derivative Thereof (e.g., Acrylamide, Acrylate Ester, Etc.)

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The Patent Description & Claims data below is from USPTO Patent Application 20120270002, Pressure-sensitive adhesive tape for flexible printed circuit.

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BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to a pressure-sensitive adhesive tape to be used for fixing a flexible printed circuit.

2. Background Art

In electronic devices, wiring circuit boards have been used and, as the wiring circuit boards, flexible printed circuits (referred to as “FPC” in some cases) have been widely utilized. The FPC is usually used in a state of being fixed to a housing of an electronic device or a reinforcing plate (such as an aluminum plate, a stainless plate and a polyimide plate). When the FPC is fixed (laminated) to the housing or the reinforcing plate, a pressure-sensitive adhesive tape is used (see Patent Document 1).

In manufacturing the electronic device, an FPC may be subjected to a high temperature process such as a solder reflow process. When subjected to such a high temperature process, a pressure-sensitive adhesive tape including a release liner may be attached to the FPC. Specifically, examples thereof include a case where one surface of a double-sided pressure-sensitive adhesive tape is protected by a release liner, and the other surface of the double-sided pressure-sensitive adhesive tape is laminated to an FPC, and the FPC with the double-sided pressure-sensitive adhesive tape is subjected to a high temperature process, and then the release liner is released therefrom, and the exposed pressure-sensitive adhesive surface is laminated to the housing.

However, in the case where an FPC to which a pressure-sensitive adhesive tape having a release liner is laminated is subjected to a high temperature process, a problem that the release liner is deteriorated by heat during the high temperature process and thus the release liner is torn off (broken), and the like, occurs. The occurrence of such a problem is significant as the heating temperature in the high temperature process increases.

Patent Document 1: JP 2006-302941A

SUMMARY

OF THE INVENTION

Accordingly, the present invention has been made in an effort to provide a pressure-sensitive adhesive tape for a flexible printed circuit, from which a release liner can be released without being torn off even after being subjected to a high temperature process such as a solder reflow process.

Thus, the present inventors have intensively studied in order to solve the problems. As a result, the inventors have found that a pressure-sensitive adhesive tape for a flexible printed circuit, from which a release liner can be released without being torn off even after being subjected to a high temperature process, can be obtained by preparing a pressure-sensitive adhesive tape including a release liner in which, on at least one surface of a pressure-sensitive adhesive layer, a tensile strength in a machine direction is controlled in a predetermined range, and a tensile strength in a machine direction after heating at 280° C. for 5 min is controlled in a predetermined range, thereby completing the present invention.

That is, the present invention provides a pressure-sensitive adhesive tape for a flexible printed circuit, including: a pressure-sensitive adhesive layer; and a release liner on at least one surface of the pressure-sensitive adhesive layer, wherein a tensile strength of the release liner in a machine direction is 50 MPa to 150 MPa, and a tensile strength of the release liner in a machine direction after heating at 280° C. for 5 min is 20 MPa to 120 MPa.

In the pressure-sensitive adhesive tape for a flexible printed circuit, the release liner preferably includes: a glassine paper or a resin coated paper; and a release treatment layer formed by a silicon-based release agent on at least one surface of the glassine paper or the resin coated paper.

In the pressure-sensitive adhesive tape for a flexible printed circuit, the pressure-sensitive adhesive layer preferably includes, as an essential component, an acrylic polymer formed from a monomer component including an acrylic monomer represented by the following formula (I) in an amount of 50 wt % or more based on an entire monomer component (100 wt %) forming the acrylic polymer:

CH2═C(R1)COOR2  (I)

wherein R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 4 to 14 carbon atoms.

In the pressure-sensitive adhesive tape for a flexible printed circuit, dimensional change rates of the release liner in both a machine direction and a transverse direction before and after storage for 24 hours under an atmosphere of 60° C. and 90% RH are preferably 2.0% or less.

In the pressure-sensitive adhesive tape, when the pressure-sensitive adhesive tape is cut to have a size of a width of 30 mm and a length of 130 mm, the cut pressure-sensitive adhesive tape is heated at 280° C. for 5 min, and then, the release liner is released from the surface of the pressure-sensitive adhesive layer under the conditions of a release angle of 90° and a tensile speed of 300 mm/min, the release liner can be preferably released from the surface of the pressure-sensitive adhesive layer without being torn off.

In the pressure-sensitive adhesive tape, the silicon-based release agent preferably includes a thermosetting silicon-based release agent.

The pressure-sensitive adhesive tape preferably has a pull tab.

Since the pressure-sensitive adhesive tape for a flexible printed circuit of the present invention has the above configuration, a release liner can be released without being torn off even after being subjected to a high temperature process, and thus, the release liner has excellent release workability. On this account, when the pressure-sensitive adhesive tape for a flexible printed circuit of the present invention is used, productivity or quality of an electronic device having the FPC is improved. In this specification, the “release workability” refers to “easiness of release or easiness of release work” of a release liner.

BRIEF DESCRIPTION OF THE DRAWINGS



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stats Patent Info
Application #
US 20120270002 A1
Publish Date
10/25/2012
Document #
13452067
File Date
04/20/2012
USPTO Class
428 415
Other USPTO Classes
428 418
International Class
32B7/06
Drawings
2



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