Decorative system composite and method   

CROSS-REFERENCE TO RELATED APPLICATIONS

The instant application claims priority to U.S. Provisional Patent Application Ser. No. 60/442,944, filed Jan. 27, 2003, and U.S. Provisional Patent Application Ser. No. 60/534,486, filed Jan. 6, 2004, the entire specifications of both of which are expressly incorporated herein by reference.

FIELD OF THE INVENTION

The present invention generally relates to thermoforming of plastic articles, and more particularly to new and improved decorative laminate composites and methods for making the same.

BACKGROUND OF THE INVENTION

In an effort to decrease automobile weight and increase energy efficiency, many automobile manufacturers are employing automobile parts that are fabricated from lightweight materials, such as plastic materials (e.g., thermoplastics and thermosets). One such class of plastic materials is generally known as thermoplastic polyolefins (TPO\'s), such as various grades of polyethylene or polypropylene. Another such class would consist of ABS or ABS/polycarbonate blends.

Some of these parts are produced by thermoforming, e.g., vacuum forming, which is generally defined as a process wherein a heated, and thus softened, amount of plastic material (typically in the form of a sheet) is molded into the desired shape through vacuum suction of the warmed plastic onto a pre-formed mold.

Thermoforming can be used for many thicknesses of plastic sheets and can provide great strength in its finished moldings. Fairly complex moldings can be achieved with thermoforming. However, these plastic materials do not typically have a desirable finish (or prematurely lose that finish when exposed to the elements) for use with automotive applications. Furthermore, these plastic materials do not possess sufficient wall thickness. For example, certain conventional automotive components are thermoformed, trimmed and then injection molded.

Various approaches have been taken to providing a high quality automotive paint-like finish to lightweight parts, such as molded plastic parts. One approach that has received considerable attention uses a surfacing film system having a decorative layer (e.g., a preformed colorant or paint-like film) that can be used to impart a surface effect (e.g., color or other visual pattern) to a thermoformed part. These surfacing film systems are generally referred to as paint or color-containing films. An example of this process can be found in U.S. Pat. No. 5,215,826 to Shimanski et al., the entire specification of which is expressly incorporated herein by reference.

By way of a non-limiting example, paint or color-containing films, especially those used in producing colored automotive components, can be comprised of a decorative layer (e.g., paint, ink, or other colorant), an optional adhesive layer (e.g., a heat-activated adhesive), a preferably scratch resistant optional top clear coat layer, and an optional removable casting base (e.g., a polyester-based sheet). These types of paint or color-containing films are readily commercially available from Avery Dennison Corp. (Pasadena, Calif.), Soliant L.L.C. (Lancaster, S.C.) and Dorrie International (Farmington Hills, Mich.). These paint or color-containing films are generally available in a wide range of colors, including solid metallic colors, and are primarily used in a number of automotive applications.

Additionally, automotive component manufacturers have also used other types of color-containing films, such as mold-in-color (MIC) films. One particular MIC film currently being used is a MIC ionomer film readily commercially available from Mayco Plastics, Inc. (Sterling Heights, Mich.) under the trade name FORMION. The MIC ionomer film typically consists of four discrete layers with a back molded (e.g., injection molded) thermoplastic polyolefin substrate. The layers typically consist of a clear ionomer layer, a colored ionomer layer, an adhesive layer, and a backing layer.

Regardless of the type of paint or color-containing film used, it is sometimes necessary to employ a removable release or masking layer to protect the surface of the component to be thermoformed, due in part to the particular processing parameters encountered during the thermoforming process. This is especially true of thick sheet polyolefin thermoforming. Thick sheet thermoforming typically employs sheets having a thickness in the range of about 0.06 to about 0.5 inches.

Typically, when the thermoforming process is completed, the component is removed from the mold surface and the release layer is then removed. Alternatively, the release layer can be left in place, for example, until the component reaches its final destination, whereupon the release layer can then be removed, thus protecting the outer surface of the component.

Unfortunately, many conventional release layer materials have several significant disadvantages, such as relatively low tensile strength, especially at the elevated temperatures typically associated with conventional thermoforming techniques, as well as undesirable bag/sag/drape control characteristics. Accordingly, when the TPO substrate is heated, regardless of whether a paint or color-containing film is present or not, the release layer exhibits significant bag/sag/drape control problems which are manifested in the TPO substrate billowing out from the frame bracket. When the TPO substrate is removed from the oven and placed over the mold face, the draping TPO material tends to gather and clump when the suction force is applied to the mold. Thus, the finished thermoformed part has significant surface irregularities and cannot be used, thus raising production costs and causing production delays.

Accordingly, there exists a need for new and improved support film systems, especially for use with paint or color-containing films, wherein the support film systems exhibit relatively high tensile strength, especially at the elevated temperatures typically associated with conventional thermoforming techniques, as well as relatively good bag/sag/drape control characteristics. Additionally, these new and improved support film systems should preserve, or at least prevent the loss of gloss characteristics of the paints films, if used, or aid in the thermoformability of the underlying plastic substrates, if paint or color-containing films are not used.

SUMMARY

In accordance with the general teachings of the present invention, new and improved decorative laminate composites and methods for forming the same are provided. New and improved support film systems are employed to form the decorative laminate composites. These support film systems of the present invention possess enhanced tensile strength, especially at elevated temperatures typically encountered during thermoforming processes. Additionally, these support film systems preserve, or at least prevent the loss of gloss characteristics of the paint or color-containing films, if used, or aid in the thermoformability of the underlying plastic substrates, if paint or color-containing films are not used.

By way of a non-limiting example, the support films preferably possess a tensile strength greater than 0.5 pounds per linear inch (pli) at about 300° F. These support films can be used in conjunction with various optional release films. The support films of the present invention are particularly suitable for use with surfacing film systems, such as but not limited to various paint or color-containing films. The support films of the present invention are also especially suitable for use in thermoforming operations to produce contoured automotive components for interior and/or exterior applications. Because of the enhanced properties of the support film of the present invention, the support films preferably exhibit enhanced bag/sag/drape control characteristics. Additionally, the support films of the present invention preferably produce components that have enhanced gloss characteristics, as compared to conventional production methods.

In accordance with a first embodiment of the present invention, a thermoformable support film is provided, wherein the support film is comprised of a material having a tensile strength greater than 0.5 pli at 300° F., wherein the support film is operable to releasably adhere to and support a polymeric substrate during a thermoforming process.

In accordance with a second embodiment of the present invention, a laminate system is provided, comprising: (1) a thermoformable support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F.; and (2) a polymeric substrate in abutting relationship with the support film; wherein the support film is operable to releasably adhere to and support the polymeric substrate during a thermoforming process.

In accordance with a third embodiment of the present invention, a support film system is provided, comprising: (1) a thermoformable support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F.; and (2) a release layer in abutting relationship with the support film; wherein the release layer is operable to releasably adhere to a polymeric substrate during a thermoforming process; wherein the support film is operable to support the polymeric substrate during the thermoforming process.

In accordance with a fourth embodiment of the present invention, a thermoformable support film system is provided, wherein the support film is comprised of: (1) a support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F., wherein the support film is operable to releasably adhere to and support a polymeric substrate during a thermoforming process; and (2) a paint or color-containing film system in abutting relationship with the support film; wherein the support film is operable to releasably adhere to the paint or color-containing film system.

In accordance with a fifth embodiment of the present invention, a thermoformable support film system is provided, wherein the support film is comprised of: (1) a support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F., wherein the support film is operable to releasably adhere to and support a polymeric substrate during a thermoforming process; (2) a paint or color-containing film system in abutting relationship with the support film; and (3) an adhesive film system in abutting relationship with the paint or color-containing film system; wherein the support film is operable to adhere to the paint or color-containing film system.

In accordance with a sixth embodiment of the present invention, a method for forming a support film system is provided, comprising: (1) providing a thermoformable support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F.; and (2) providing a release layer in abutting relationship with the support film; wherein the release layer is operable to releasably adhere to a polymeric substrate during a thermoforming process; wherein the support film is operable to support the polymeric substrate during the thermoforming process.

In accordance with a seventh embodiment of the present invention, a method for forming a laminate system is provided, comprising: (1) providing a thermoformable support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F.; and (2) providing a polymeric substrate in abutting relationship with the support film; wherein the support film is operable to releasably adhere to and support the polymeric substrate during a thermoforming process.

In accordance with an eighth embodiment of the present invention, a method for forming a laminate system is provided, comprising: (1) providing a thermoformable support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F.; (2) providing a release layer in abutting relationship with the support film; (3) providing a surfacing film system in abutting relationship with the release layer; and (4) providing a polymeric substrate in abutting relationship with the surfacing film system; wherein the release layer is operable to releasably adhere to the surfacing film system during the thermoforming process; wherein the support film is operable to support the polymeric substrate during the thermoforming process.

In accordance with a ninth embodiment of the present invention, a method for forming a support film system is provided, comprising: (1) providing a thermoformable support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F.; and (2) providing a paint or color-containing film system in abutting relationship with the support film; wherein the support film is operable to releasably adhere to and support the paint or color-containing film system during a thermoforming process.

In accordance with a tenth embodiment of the present invention, a method for forming a support film system is provided, comprising: (1) providing a thermoformable support film comprised of a material having a tensile strength greater than 0.5 pli at 300° F.; (2) providing a paint or color-containing film system in abutting relationship with the support film; and (3) providing an adhesive film system in abutting relationship with the paint or color-containing film system; wherein the support film is operable to releasably adhere to and support the paint or color-containing film system during a thermoforming process.

A further understanding of the present invention will be had in view of the description of the drawings and detailed description of the invention, when viewed in conjunction with the subjoined claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partial sectional view of a support film, in accordance with the general teachings of the present invention;

FIG. 2 is a partial sectional view of the support film shown in FIG. 1 in abutting relationship with a substrate, in accordance with the general teachings of the present invention;

FIG. 2A is a partial sectional view of two support films in abutting relationship with a substrate, in accordance with the general teachings of the present invention;

FIG. 3 is a partial sectional view of the support film shown in FIGS. 1 and 2 being removed from the substrate, in accordance with the general teachings of the present invention;

FIG. 4 is a partial sectional view of an alternative support film, in accordance with a first alternative embodiment of the present invention;

FIG. 5 is a partial sectional view of the alternative support film shown in FIG. 4 in abutting relationship with a substrate, in accordance with a first alternative embodiment of the present invention;

FIG. 5A is a partial sectional view of two support films in abutting relationship with a substrate, in accordance with a first alternative embodiment of the present invention;

FIG. 6 is a partial sectional view of the alternative support film shown in FIGS. 4 and 5 being removed from the substrate, in accordance with a first alternative embodiment of the present invention;

FIG. 7 is a partial sectional view of a support film and a release film, in accordance with a second alternative embodiment of the present invention;

FIG. 8 is a partial sectional view of the support film and release film shown in FIG. 7 in abutting relationship with a substrate, in accordance with a second alternative embodiment of the present invention;

FIG. 8A is a partial sectional view of two support films in abutting relationship with a release film and a substrate, in accordance with a second alternative embodiment of the present invention;

FIG. 9 is a partial sectional view of the support film and release film shown in FIGS. 7 and 8 being removed from the substrate, in accordance with a second alternative embodiment of the present invention;

FIG. 10 is a partial sectional view of a support film in abutting relationship with an alternative release film, in accordance with a third alternative embodiment of the present invention;

FIG. 11 is a partial sectional view of the support film and alternative release film shown in FIG. 10 in abutting relationship with a substrate, in accordance with a third alternative embodiment of the present invention;

FIG. 11A is a partial sectional view of two support films in abutting relationship with an alternative release film and a substrate, in accordance with a third alternative embodiment of the present invention;

FIG. 12 is a partial sectional view of the support film and alternative release film shown in FIGS. 10 and 11 being removed from the substrate, in accordance with a third alternative embodiment of the present invention;

FIG. 13 is a partial sectional view of an alternative support film and a release film, in accordance with a fourth alternative embodiment of the present invention;

FIG. 14 is a partial sectional view of the alternative support film and release film shown in FIG. 13 in abutting relationship with a substrate, in accordance with a fourth alternative embodiment of the present invention;

FIG. 14A is a partial sectional view of two support films in abutting relationship with a release film and a substrate, in accordance with a fourth alternative embodiment of the present invention;

FIG. 15 is a partial sectional view of the alternative support film and release film shown in FIGS. 13 and 14 being removed from the substrate, in accordance with a fourth alternative embodiment of the present invention;

FIG. 16 is a partial sectional view of an alternative support film and an alternative release film, in accordance with a fifth alternative embodiment of the present invention;

FIG. 17 is a partial sectional view of the alternative support film and alternative release film shown in FIG. 16 in abutting relationship with a substrate, in accordance with a fifth alternative embodiment of the present invention;

FIG. 17A is a partial sectional view of two support films in abutting relationship with an alternative release film and a substrate, in accordance with a fifth alternative embodiment of the present invention;

FIG. 18 is a partial sectional view of the alternative support film and alternative release film shown in FIGS. 16 and 17 being removed from the substrate, in accordance with a fifth alternative embodiment of the present invention;

FIG. 19 is a partial sectional view of a support film and a surfacing film in abutting relationship with a substrate, in accordance with a sixth alternative embodiment of the present invention;

FIG. 19A is a partial sectional view of two support films in abutting relationship with a surfacing film and a substrate, in accordance with a sixth alternative embodiment of the present invention;

FIG. 20 is a partial sectional view of the support film shown in FIG. 19 being removed from the surfacing film, in accordance with a sixth alternative embodiment of the present invention;

FIG. 21 is a partial sectional view of an alternative support film and a surfacing film in abutting relationship with a substrate, in accordance with a seventh alternative embodiment of the present invention;

FIG. 21A is a partial sectional view of two support films in abutting relationship with a surfacing film and a substrate, in accordance with a seventh alternative embodiment of the present invention;

FIG. 22 is a partial sectional view of the alternative support film shown in FIG. 21 being removed from the surfacing film, in accordance with a seventh alternative embodiment of the present invention;

FIG. 23 is a partial sectional view of a support film, a release film, and a surfacing film in abutting relationship with a substrate, in accordance with an eighth alternative embodiment of the present invention;

FIG. 23A is a partial sectional view of two support films in abutting relationship with a release film and a substrate, in accordance with an eighth alternative embodiment of the present invention;

FIG. 24 is a partial sectional view of the support film and release film shown in FIG. 23 being removed from the surfacing film, in accordance with an eighth alternative embodiment of the present invention;

FIG. 25 is a partial sectional view of a support film, an alternative release film, and a surfacing film in abutting relationship with a substrate, in accordance with a ninth alternative embodiment of the present invention;

FIG. 25A is a partial sectional view of two support films in abutting relationship with an alternative release film and a substrate, in accordance with a ninth alternative embodiment of the present invention;

FIG. 26 is a partial sectional view of the support film and alternative release film shown in FIG. 25 being removed from the surfacing film, in accordance with a ninth alternative embodiment of the present invention;

FIG. 27 is a partial sectional view of an alternative support film, a release film, and a surfacing film in abutting relationship with a substrate, in accordance with a tenth alternative embodiment of the present invention;

FIG. 27A is a partial sectional view of two support films in abutting relationship with a release film and a substrate, in accordance with a tenth alternative embodiment of the present invention;

FIG. 28 is a partial sectional view of the alternative support film and release film shown in FIG. 27 being removed from the surfacing film, in accordance with a tenth alternative embodiment of the present invention;

FIG. 29 is a partial sectional view of an alternative support film, an alternative release film, and a surfacing film in abutting relationship with a substrate, in accordance with an eleventh alternative embodiment of the present invention;

FIG. 29A is a partial sectional view of two support films in abutting relationship with an alternative release film and a substrate, in accordance with an eleventh alternative embodiment of the present invention;

FIG. 30 is a partial sectional view of the alternative support film and alternative release film shown in FIG. 29 being removed from the surfacing film, in accordance with an eleventh alternative embodiment of the present invention;

FIG. 31 is a partial sectional view of a thermoplastic polyolefin primer film, in accordance with the prior art;

FIG. 32 is a partial sectional view of the thermoplastic polyolefin primer film shown in FIG. 31 in abutting relationship with a substrate, in accordance with the prior art;

FIG. 33 is a partial sectional view of a support film and the thermoplastic polyolefin primer film shown in FIGS. 31 and 32 in abutting relationship with a substrate, in accordance with a twelfth embodiment of the present invention;

FIG. 33A is a partial sectional view of two support films in abutting relationship with a primer film and a substrate, in accordance with a twelfth alternative embodiment of the present invention;

FIG. 34 is a partial sectional view of the support film being removed from the thermoplastic polyolefin primer film shown in FIGS. 31-33, in accordance with an twelfth alternative embodiment of the present invention;

FIG. 35 is a partial sectional view of an alternative support film and the thermoplastic polyolefin primer film shown in FIGS. 31-33 in abutting relationship with a substrate, in accordance with a thirteenth alternative embodiment of the present invention;

FIG. 35A is a partial sectional view of two support films in abutting relationship with a primer film and a substrate, in accordance with a second alternative embodiment of the present invention;

FIG. 36 is a partial sectional view of the alternative support film shown in FIG. 35 being removed from the thermoplastic polyolefin primer film shown in FIGS. 31-35, in accordance with a thirteenth alternative embodiment of the present invention;

FIG. 37 is a partial schematic view of a lamination process wherein a support film is applied to an extruded substrate, in accordance with a fourteenth alternative embodiment of the present invention;

FIG. 37A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a fourteenth alternative embodiment of the present invention;

FIG. 38 is a partial schematic view of a thermoforming process wherein the laminated support film/substrate portion shown in FIG. 37 is heated prior to shaping into the form of a component, in accordance with a fourteenth alternative embodiment of the present invention;

FIG. 39 is a partial sectional view of a mold surface being used to shape the laminated support film/substrate portion shown in FIG. 38 to the form of the component, in accordance with a fourteenth alternative embodiment of the present invention;

FIG. 40 is a partial sectional view of the formed component comprised of the shaped laminated support film/substrate portion shown in FIGS. 38-39 once it has been removed from the mold surface, in accordance with a fourteenth alternative embodiment of the present invention;

FIG. 41 is a partial sectional view of the support film shown in FIGS. 38-40 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a fourteenth alternative embodiment of the present invention;

FIG. 42 is a partial schematic view of a lamination process wherein an alternative support film is applied to an extruded substrate, in accordance with a fifteenth alternative embodiment of the present invention;

FIG. 42A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a fifteenth alternative embodiment of the present invention;

FIG. 43 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/substrate portion shown in FIG. 42 is heated prior to shaping into the form of a component, in accordance with a fifteenth alternative embodiment of the present invention;

FIG. 44 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/substrate portion shown in FIG. 43 to the form of the component, in accordance with a fifteenth alternative embodiment of the present invention;

FIG. 45 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/substrate portion shown in FIGS. 43-44 once it has been removed from the mold surface, in accordance with a fifteenth alternative embodiment of the present invention;

FIG. 46 is a partial sectional view of the alternative support film shown in FIGS. 43-45 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a fifteenth alternative embodiment of the present invention;

FIG. 47 is a partial, schematic view of a lamination process wherein a support film/release film system is applied to an extruded substrate, in accordance with a sixteenth alternative embodiment of the present invention;

FIG. 47A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a sixteenth alternative embodiment of the present invention;

FIG. 48 is a partial schematic view of a thermoforming process wherein the laminated support film/release film/substrate portion shown in FIG. 47 is heated prior to shaping into the form of a component, in accordance with a sixteenth alternative embodiment of the present invention;

FIG. 49 is a partial sectional view of a mold surface being used to shape the laminated support film/release film system/substrate portion shown in FIG. 48 to the form of the component, in accordance with a sixteenth alternative embodiment of the present invention;

FIG. 50 is a partial sectional view of the formed component comprised of the shaped laminated support film/release film system/substrate portion shown in FIGS. 48-49 once it has been removed from the mold surface, in accordance with a sixteenth alternative embodiment of the present invention;

FIG. 51 is a partial sectional view of the support film/release film system shown in FIGS. 48-50 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a sixteenth alternative embodiment of the present invention;

FIG. 52 is a partial schematic view of a lamination process wherein a support film/alternative release film system is applied to an extruded substrate, in accordance with a seventeenth alternative embodiment of the present invention;

FIG. 52A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a seventeenth alternative embodiment of the present invention;

FIG. 53 is a partial schematic view of a thermoforming process wherein the laminated support film/alternative release film system/substrate portion shown in FIG. 52 is heated prior to shaping into the form of a component, in accordance with a seventeenth alternative embodiment of the present invention;

FIG. 54 is a partial sectional view of a mold surface being used to shape the laminated support film/alternative release film system/substrate portion shown in FIG. 53 to the form of the component, in accordance with a seventeenth alternative embodiment of the present invention;

FIG. 55 is a partial sectional view of the formed component comprised of the shaped laminated support film/alternative release film system/substrate portion shown in FIGS. 53-54 once it has been removed from the mold surface, in accordance with a seventeenth alternative embodiment of the present invention;

FIG. 56 is a partial sectional view of the support film/alternative release film system shown in FIGS. 53-55 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a seventeenth alternative embodiment of the present invention;

FIG. 57 is a partial schematic view of a lamination process wherein an alternative support film/release film system is applied to an extruded substrate, in accordance with an eighteenth alternative embodiment of the present invention;

FIG. 57A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with an eighteenth alternative embodiment of the present invention;

FIG. 58 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/release film system/substrate portion shown in FIG. 57 is heated prior to shaping into the form of a component, in accordance with an eighteenth alternative embodiment of the present invention;

FIG. 59 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/release film system/substrate portion shown in FIG. 58 to the form of the component, in accordance with an eighteenth alternative embodiment of the present invention;

FIG. 60 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/release film system/substrate portion shown in FIGS. 58-59 once it has been removed from the mold surface, in accordance with an eighteenth alternative embodiment of the present invention;

FIG. 61 is a partial sectional view of the alternative support film/release film system shown in FIGS. 58-60 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with an eighteenth alternative embodiment of the present invention;

FIG. 62 is a partial schematic view of a lamination process wherein an alternative support film/alternative release film system is applied to an extruded substrate, in accordance with a nineteenth alternative embodiment of the present invention;

FIG. 62A is a partial schematic view of a lamination process wherein an optional alternative second support film is applied to an extruded substrate, in accordance with a nineteenth alternative embodiment of the present invention;

FIG. 63 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/alternative release film system/substrate portion shown in FIG. 62 is heated prior to shaping into the form of a component, in accordance with a nineteenth alternative embodiment of the present invention;

FIG. 64 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/alternative release film system/substrate portion shown in FIG. 63 to the form of the component, in accordance with a nineteenth alternative embodiment of the present invention;

FIG. 65 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/alternative release film system/substrate portion shown in FIGS. 63-64 once it has been removed from the mold surface, in accordance with a nineteenth alternative embodiment of the present invention;

FIG. 66 is a partial sectional view of the alternative support film/alternative release film system shown in FIGS. 63-65 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a nineteenth alternative embodiment of the present invention;

FIG. 67 is a partial schematic view of a lamination process wherein a thermoplastic polyolefin primer film is applied to an extruded substrate, in accordance with the prior art;

FIG. 68 is a partial schematic view of a thermoforming process wherein the laminated primer film/substrate portion shown in FIG. 67 is heated prior to shaping into the form of a component, in accordance with the prior art;

FIG. 69 is a partial sectional view of a mold surface being used to shape the laminated primer film/substrate portion shown in FIG. 68 to the form of the component, in accordance with the prior art;

FIG. 70 is a partial sectional view of the formed component comprised of the shaped laminated primer film/substrate portion shown in FIGS. 68-69 once it has been removed from the mold surface, in accordance with the prior art;

FIG. 71 is a partial sectional view of the component comprised of the primer film/substrate system shown in FIGS. 68-70 after being trimmed to the requisite dimensions, in accordance with the prior art;

FIG. 72 is a partial schematic view of a lamination process wherein a thermoplastic polyolefin primer film and a support film are applied to an extruded substrate, in accordance with a twentieth alternative embodiment of the present invention;

FIG. 72A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a twentieth alternative embodiment of the present invention;

FIG. 73 is a partial schematic view of a thermoforming process wherein the laminated support film/primer film/substrate portion shown in FIG. 72 is heated prior to shaping into the form of a component, in accordance with a twentieth alternative embodiment of the present invention;

FIG. 74 is a partial sectional view of a mold surface being used to shape the laminated support film/primer film/substrate portion shown in FIG. 73 to the form of the component, in accordance with a twentieth alternative embodiment of the present invention;

FIG. 75 is a partial sectional view of the formed component comprised of the shaped laminated support film/primer film/substrate portion shown in FIGS. 73-74 once it has been removed from the mold surface, in accordance with a twentieth alternative embodiment of the present invention;

FIG. 76 is a partial sectional view of the support film shown in FIGS. 73-75 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twentieth alternative embodiment of the present invention;

FIG. 77 is a partial schematic view of a lamination process wherein a thermoplastic polyolefin primer film and an alternative support film are applied to an extruded substrate, in accordance with a twenty-first alternative embodiment of the present invention;

FIG. 77A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a twenty-first alternative embodiment of the present invention;

FIG. 78 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/primer film/substrate portion shown in FIG. 77 is heated prior to shaping into the form of a component, in accordance with a twenty-first alternative embodiment of the present invention;

FIG. 79 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/primer film/substrate portion shown in FIG. 78 to the form of the component, in accordance with a twenty-first alternative embodiment of the present invention;

FIG. 80 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/primer film/substrate portion shown in FIGS. 78-79 once it has been removed from the mold surface, in accordance with a twenty-first alternative embodiment of the present invention;

FIG. 81 is a partial sectional view of the alternative support film shown in FIGS. 78-80 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-first alternative embodiment of the present invention;

FIG. 82 is a partial schematic view of a lamination process wherein a support film and a release film are applied to an extruded substrate, in accordance with a twenty-second alternative embodiment of the present invention;

FIG. 82A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a twenty-second alternative embodiment of the present invention;

FIG. 83 is a partial schematic view of a thermoforming process wherein the laminated support film/release film/substrate portion shown in FIG. 82 is heated prior to shaping into the form of a component, in accordance with a twenty-second alternative embodiment of the present invention;

FIG. 84 is a partial sectional view of a mold surface being used to shape the laminated support film/release film/substrate portion shown in FIG. 83 to the form of the component, in accordance with a twenty-second alternative embodiment of the present invention;

FIG. 85 is a partial sectional view of the formed component comprised of the shaped laminated support film/release film/substrate portion shown in FIGS. 83-84 once it has been removed from the mold surface, in accordance with a twenty-second alternative embodiment of the present invention;

FIG. 86 is a partial sectional view of the support film/release layer system shown in FIGS. 83-85 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-second alternative embodiment of the present invention;

FIG. 87 is a partial schematic view of a lamination process wherein a support film and an alternative release film are applied to an extruded substrate, in accordance with a twenty-third alternative embodiment of the present invention;

FIG. 87A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a twenty-third alternative embodiment of the present invention;

FIG. 88 is a partial schematic view of a thermoforming process wherein the laminated support film/alternative release film/substrate portion shown in FIG. 87 is heated prior to shaping into the form of a component, in accordance with a twenty-third alternative embodiment of the present invention;

FIG. 89 is a partial sectional view of a mold surface being used to shape the laminated support film/alternative release film/substrate portion shown in FIG. 88 to the form of the component, in accordance with a twenty-third alternative embodiment of the present invention;

FIG. 90 is a partial sectional view of the formed component comprised of the laminated system support film/alternative release film/substrate portion shown in FIGS. 88-89 once it has been removed from the mold surface, in accordance with a twenty-third alternative embodiment of the present invention;

FIG. 91 is a partial sectional view of the support film/alternative release layer system shown in FIGS. 88-90 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-third alternative embodiment of the present invention;

FIG. 92 is a partial schematic view of a lamination process wherein an alternative support film and a release film are applied to an extruded substrate, in accordance with a twenty-fourth alternative embodiment of the present invention;

FIG. 92A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a twenty-fourth alternative embodiment of the present invention;

FIG. 93 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/release film/substrate portion shown in FIG. 92 is heated prior to shaping into the form of a component, in accordance with a twenty-fourth alternative embodiment of the present invention;

FIG. 94 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/release film/substrate portion shown in FIG. 93 to the form of the component, in accordance with a twenty-fourth alternative embodiment of the present invention;

FIG. 95 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/release film/substrate portion shown in FIGS. 93-94 once it has been removed from the mold surface, in accordance with a twenty-fourth alternative embodiment of the present invention;

FIG. 96 is a partial sectional view of the alternative support film/release layer system shown in FIGS. 92-95 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-fourth alternative embodiment of the present invention;

FIG. 97 is a partial schematic view of a lamination process wherein an alternative support film and an alternative release film are applied to an extruded substrate, in accordance with a twenty-fifth alternative embodiment of the present invention;

FIG. 97A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a twenty-fifth alternative embodiment of the present invention;

FIG. 98 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/alternative release film/substrate portion shown in FIG. 97 is heated prior to shaping into the form of a component, in accordance with a twenty-fifth alternative embodiment of the present invention;

FIG. 99 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/alternative release film/substrate portion shown in FIG. 98 to the form of the component, in accordance with a twenty-fifth alternative embodiment of the present invention;

FIG. 100 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/alternative release film/substrate portion shown in FIGS. 98-99 once it has been removed from the mold surface, in accordance with a twenty-fifth alternative embodiment of the present invention;

FIG. 101 is a partial sectional view of the alternative support film/alternative release layer system shown in FIGS. 98-100 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-fifth embodiment of the present invention;

FIG. 102 is a partial schematic view of a lamination process wherein a support film and a surfacing film are applied to an extruded substrate, in accordance with a twenty-sixth alternative embodiment of the present invention;

FIG. 102A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a twenty-sixth alternative embodiment of the present invention;

FIG. 103 is a partial schematic view of a thermoforming process wherein the laminated support film/surfacing film/substrate portion shown in FIG. 102 is heated prior to shaping into the form of a component, in accordance with a twenty-sixth alternative embodiment of the present invention;

FIG. 104 is a partial sectional view of a mold surface being used to shape the laminated support film/surfacing film/substrate portion shown in FIG. 103 to the form of the component, in accordance with a twenty-sixth alternative embodiment of the present invention;

FIG. 105 is a partial sectional view of the formed component comprised of the shaped laminated support film/surfacing film/substrate portion shown in FIGS. 103-104 once it has been removed from the mold surface, in accordance with a twenty-sixth alternative embodiment of the present invention;

FIG. 106 is a partial sectional view of the support film shown in FIGS. 103-105 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-sixth alternative embodiment of the present invention;

FIG. 107 is a partial schematic view of a lamination process wherein an alternative support film and a surfacing film are applied to an extruded substrate, in accordance with a twenty-seventh alternative embodiment of the present invention;

FIG. 107A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a twenty-seventh alternative embodiment of the present invention;

FIG. 108 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/surfacing film/substrate portion shown in FIG. 107 is heated prior to shaping into the form of a component, in accordance with a twenty-seventh alternative embodiment of the present invention;

FIG. 109 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/surfacing film/substrate portion shown in FIG. 108 to the form of the component, in accordance with a twenty-seventh alternative embodiment of the present invention;

FIG. 110 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/surfacing film/substrate portion shown in FIGS. 108-109 once it has been removed from the mold surface, in accordance with a twenty-seventh alternative embodiment of the present invention;

FIG. 111 is a partial sectional view of the alternative support film shown in FIGS. 108-110 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-seventh alternative embodiment of the present invention;

FIG. 112 is a partial schematic view of a lamination process wherein a support film/release film system and a surfacing film are applied to an extruded substrate, in accordance with a twenty-eighth alternative embodiment of the present invention;

FIG. 112A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a twenty-eighth alternative embodiment of the present invention;

FIG. 113 is a partial schematic view of a thermoforming process wherein the laminated support film/release film/surfacing film/substrate portion shown in FIG. 112 is heated prior to shaping into the form of a component, in accordance with a twenty-eighth alternative embodiment of the present invention;

FIG. 114 is a partial sectional view of a mold surface being used to shape the laminated support film/release film/surfacing film/substrate portion shown in FIG. 113 to the form of the component, in accordance with a twenty-eighth alternative embodiment of the present invention;

FIG. 115 is a partial sectional view of the formed component comprised of the shaped laminated support film/release film/surfacing film/substrate portion shown in FIGS. 113-114 once it has been removed from the mold surface, in accordance with a twenty-eighth alternative embodiment of the present invention;

FIG. 116 is a partial sectional view of the support film/release film system shown in FIGS. 113-115 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-eighth alternative embodiment of the present invention;

FIG. 117 is a partial schematic view of a lamination process wherein a support film/alternative release film system and a surfacing film are applied to an extruded substrate, in accordance with a twenty-ninth alternative embodiment of the present invention;

FIG. 117A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a twenty-ninth alternative embodiment of the present invention;

FIG. 118 is a partial schematic view of a thermoforming process wherein the laminated support film/alternative release film/surfacing film/substrate portion shown in FIG. 117 is heated prior to shaping into the form of a component, in accordance with a twenty-ninth alternative embodiment of the present invention;

FIG. 119 is a partial sectional view of a mold surface being used to shape the laminated support film/alternative release film/surfacing film/substrate portion shown in FIG. 118 to the form of the component, in accordance with a twenty-ninth alternative embodiment of the present invention;

FIG. 120 is a partial sectional view of the formed component comprised of the shaped laminated support film/alternative release film/surfacing film/substrate portion shown in FIGS. 118-119 once it has been removed from the mold surface, in accordance with a twenty-ninth alternative embodiment of the present invention;

FIG. 121 is a partial sectional view of the support film/alternative release film system shown in FIGS. 118-120 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-ninth alternative embodiment of the present invention;

FIG. 122 is a partial schematic view of a lamination process wherein an alternative support film/release film system and a surfacing film are applied to an extruded substrate, in accordance with a thirtieth alternative embodiment of the present invention;

FIG. 122A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a thirtieth alternative embodiment of the present invention;

FIG. 123 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/release film/surfacing film/substrate portion shown in FIG. 122 is heated prior to shaping into the form of a component, in accordance with a thirtieth alternative embodiment of the present invention;

FIG. 124 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/release film/surfacing film/substrate portion shown in FIG. 123 to the form of the component, in accordance with a thirtieth alternative embodiment of the present invention;

FIG. 125 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/release film/surfacing film/substrate portion shown in FIGS. 123-124 once it has been removed from the mold surface, in accordance with a thirtieth alternative embodiment of the present invention;

FIG. 126 is a partial sectional view of the alternative support film/release film system shown in FIGS. 123-125 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a twenty-eighth alternative embodiment of the present invention;

FIG. 127 is a partial schematic view of a lamination process wherein an alternative support film/alternative release film system and a surfacing film are applied to an extruded substrate, in accordance with a thirty-first alternative embodiment of the present invention;

FIG. 127A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a thirty-first alternative embodiment of the present invention;

FIG. 128 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/alternative release film/surfacing film/substrate portion shown in FIG. 127 is heated prior to shaping into the form of a component, in accordance with a thirty-first alternative embodiment of the present invention;

FIG. 129 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/alternative release film/surfacing film/substrate portion shown in FIG. 128 to the form of the component, in accordance with a thirty-first alternative embodiment of the present invention;

FIG. 130 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/alternative release film/surfacing film/substrate portion shown in FIGS. 128-129 once it has been removed from the mold surface, in accordance with a thirty-first alternative embodiment of the present invention;

FIG. 131 is a partial sectional view of the alternative support film/alternative release film system shown in FIGS. 128-130 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a thirty-first alternative embodiment of the present invention;

FIG. 132 is a partial schematic view of a lamination process wherein a support film, a release film, and a surfacing film are applied to an extruded substrate, in accordance with a thirty-second alternative embodiment of the present invention;

FIG. 132A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a thirty-second alternative embodiment of the present invention;

FIG. 133 is a partial schematic view of a thermoforming process wherein the laminated support film/release film/surfacing film/substrate portion shown in FIG. 132 is heated prior to shaping into the form of a component, in accordance with a thirty-second alternative embodiment of the present invention;

FIG. 134 is a partial sectional view of a mold surface being used to shape the laminated support film/release film/surfacing film/substrate portion shown in FIG. 133 to the form of the component, in accordance with a thirty-second alternative embodiment of the present invention;

FIG. 135 is a partial sectional view of the formed component comprised of the shaped laminated support film/release film/surfacing film/substrate portion shown in FIGS. 133-134 once it has been removed from the mold surface, in accordance with a thirty-second alternative embodiment of the present invention;

FIG. 136 is a partial sectional view of the support film/release film system shown in FIGS. 133-135 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a thirty-second alternative embodiment of the present invention;

FIG. 137 is a partial schematic view of a lamination process wherein a support film, an alternative release film, and a surfacing film are applied to an extruded substrate, in accordance with a thirty-third alternative embodiment of the present invention;

FIG. 137A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a thirty-third alternative embodiment of the present invention;

FIG. 138 is a partial schematic view of a thermoforming process wherein the laminated support film/alternative release film/surfacing film/substrate portion shown in FIG. 137 is heated prior to shaping into the form of a component, in accordance with a thirty-third alternative embodiment of the present invention;

FIG. 139 is a partial sectional view of a mold surface being used to shape the laminated support film/alternative release film/surfacing film/substrate portion shown in FIG. 138 to the form of the component, in accordance with a thirty-third alternative embodiment of the present invention;

FIG. 140 is a partial sectional view of the formed component comprised of the shaped laminated support film/alternative release film/surfacing film/substrate portion shown in FIGS. 138-139 once it has been removed from the mold surface, in accordance with a thirty-third alternative embodiment of the present invention;

FIG. 141 is a partial sectional view of the support film/alternative release film system shown in FIGS. 138-140 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a thirty-third alternative embodiment of the present invention;

FIG. 142 is a partial schematic view of a lamination process wherein an alternative support film, a release film, and a surfacing film are applied to an extruded substrate, in accordance with a thirty-fourth alternative embodiment of the present invention;

FIG. 142A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a thirty-fourth alternative embodiment of the present invention;

FIG. 143 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/release film/surfacing film/substrate portion shown in FIG. 142 is heated prior to shaping into the form of a component, in accordance with a thirty-fourth alternative embodiment of the present invention;

FIG. 144 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/release film/surfacing film/substrate portion shown in FIG. 143 to the form of the component, in accordance with a thirty-fourth alternative embodiment of the present invention;

FIG. 145 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/release film/surfacing film/substrate portion shown in FIGS. 143-144 once it has been removed from the mold surface, in accordance with a thirty-fourth alternative embodiment of the present invention;

FIG. 146 is a partial sectional view of the alternative support film/release film system shown in FIGS. 143-145 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a thirty-fourth alternative embodiment of the present invention;

FIG. 147 is a partial schematic view of a lamination process wherein an alternative support film, an alternative release film, and a surfacing film are applied to an extruded substrate, in accordance with a thirty-fifth alternative embodiment of the present invention;

FIG. 147A is a partial schematic view of a lamination process wherein an optional second alternative support film is applied to an extruded substrate, in accordance with a thirty-fifth alternative embodiment of the present invention;

FIG. 148 is a partial schematic view of a thermoforming process wherein the laminated alternative support film/alternative release film/surfacing film/substrate portion shown in FIG. 147 is heated prior to shaping into the form of a component, in accordance with a thirty-fifth alternative embodiment of the present invention;

FIG. 149 is a partial sectional view of a mold surface being used to shape the laminated alternative support film/alternative release film/surfacing film/substrate portion shown in FIG. 148 to the form of the component, in accordance with a thirty-fifth alternative embodiment of the present invention;

FIG. 150 is a partial sectional view of the formed component comprised of the shaped laminated alternative support film/alternative release film/surfacing film/substrate portion shown in FIGS. 148-149 once it has been removed from the mold surface, in accordance with a thirty-fifth alternative embodiment of the present invention;

FIG. 151 is a partial sectional view of the alternative support film/alternative release film system shown in FIGS. 148-150 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a thirty-fifth alternative embodiment of the present invention;

FIG. 152 is a partial schematic view of a lamination process wherein an adhesive film, a clear coat/base coat film, and a combined release film/support film are applied to an extruded substrate, in accordance with a thirty-sixth alternative embodiment of the present invention;

FIG. 152A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a thirty-sixth alternative embodiment of the present invention;

FIG. 153 is a partial schematic view of a thermoforming process wherein the laminated adhesive film/clear coat/base coat film/combined release film/support film system/substrate portion shown in FIG. 152 is heated prior to shaping into the form of a component, in accordance with a thirty-sixth alternative embodiment of the present invention;

FIG. 154 is a partial sectional view of a mold surface being used to shape the laminated adhesive film/clear coat/base coat film/combined release film/support film system/substrate portion shown in FIG. 153 to the form of the component, in accordance with a thirty-sixth alternative embodiment of the present invention;

FIG. 155 is a partial sectional view of the formed component comprised of the shaped laminated adhesive film/clear coat/base coat film/combined release film/support film system/substrate portion shown in FIGS. 153-154 once it has been removed from the mold surface, in accordance with a thirty-sixth alternative embodiment of the present invention;

FIG. 156 is a partial sectional view of the combined release film/support film system shown in FIGS. 153-155 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a thirty-sixth alternative embodiment of the present invention;

FIG. 157 is a partial schematic view of a lamination process wherein an adhesive film, a clear coat/base coat film, a release film, and a support film are applied to an extruded substrate, in accordance with a thirty-seventh alternative embodiment of the present invention;

FIG. 157A is a partial schematic view of a lamination process wherein an optional second support film is applied to an extruded substrate, in accordance with a thirty-seventh alternative embodiment of the present invention;

FIG. 158 is a partial schematic view of a thermoforming process wherein the laminated adhesive film/clear coat/base coat film/release film/support film/substrate portion shown in FIG. 157 is heated prior to shaping into the form of a component, in accordance with a thirty-seventh alternative embodiment of the present invention;

FIG. 159 is a partial sectional view of a mold surface being used to shape the laminated adhesive film/clear coat/base coat film/release film/support film/substrate portion shown in FIG. 158 to the form of the component, in accordance with a thirty-seventh alternative embodiment of the present invention;

FIG. 160 is a partial sectional view of the formed component comprised of the shaped laminated adhesive film/clear coat/base coat film/release film/support film/substrate portion shown in FIGS. 158-159 once it has been removed from the mold surface, in accordance with a thirty-seventh alternative embodiment of the present invention;

FIG. 161 is a partial sectional view of the release film/support film system shown in FIGS. 158-160 being removed from the formed component which has been trimmed to the requisite dimensions, in accordance with a thirty-seventh alternative embodiment of the present invention;

FIG. 162 is a partial sectional view illustrating the drape characteristic of a surfacing film/substrate system heated at 360° F., in accordance with the prior art;

FIG. 163 is a partial sectional view illustrating the drape characteristic of a release film/surfacing film/substrate system heated at 360° F., in accordance with the prior art;

FIG. 164 is a partial sectional view illustrating the drape characteristic of a surfacing film/substrate system heated at 340° F., in accordance with the prior art;

FIG. 165 is a partial sectional view illustrating the drape characteristic of a release film/surfacing film/substrate system heated at 340° F., in accordance with the prior art;

FIG. 166 is a partial sectional view illustrating the drape characteristic of a support film/release film system/surfacing film/substrate system heated at 360° F., in accordance with a thirty-eighth alternative embodiment of the present invention;

FIG. 167 is a partial sectional view illustrating the drape characteristic of a support film/release film/surfacing film/substrate system heated at 360° F., in accordance with a thirty-ninth alternative embodiment of the present invention;

FIG. 168 is a partial sectional view illustrating the drape characteristic of a support film/release film system/surfacing film/substrate system heated at 340° F., in accordance with a fortieth alternative embodiment of the present invention; and

FIG. 169 is a partial sectional view illustrating the drape characteristic of a support film/release film/surfacing film/substrate system heated at 360° F., in accordance with a forty-first alternative embodiment of the present invention.

The same reference numerals refer to the same parts throughout the various Figures.

DETAILED DESCRIPTION

In accordance with one embodiment of the present invention, a support film 10 is provided, as generally shown in FIG. 1. Support film 10 is preferably thermoformable, in that it is suitable for use with conventional thermoforming techniques. In accordance with a preferred embodiment of the present invention, support film 10 is preferably comprised of a polymeric material having a tensile strength greater than 0.5 pli at 300° F., more preferably in the range of greater than 0.5 pli to about 1.6 pli or greater at 300° F., and still more preferably in the range of about 0.75 pli to about 1.0 pli or greater.