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Heat-dissipating module

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Title: Heat-dissipating module.
Abstract: A heat-dissipating module includes a base and at least one heat pipe. The base has a heat-absorbing surface and a heat-conducting surface opposite to the heat-absorbing surface. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion has a non-planar surface and a planar surface abutting against the heat-conducting surface to be integrally connected therewith. With the integral connection of the base and the heat pipe, the manufacturing procedure is simplified with fewer working steps. Further, the production cost of the heat-dissipating module is saved. ...


Inventor: Chun-Ming Wu
USPTO Applicaton #: #20120043057 - Class: 16510426 (USPTO) - 02/23/12 - Class 165 
Heat Exchange > Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat >Liquid Fluent Heat Exchange Material >Utilizing Change Of State >Utilizing Capillary Attraction



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The Patent Description & Claims data below is from USPTO Patent Application 20120043057, Heat-dissipating module.

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BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat-dissipating module, and in particular to a heat-dissipating module, whereby the manufacturing procedure is simplified with fewer working steps and reduced cost.

2. Description of Prior Art

The electronic element (such as a central processor) in a modern electronic device (such as a notebook computer) often generates a great amount of heat during its operation, which results in the rising of the temperature of the electronic element. If the heat is not dissipated properly, the heat may be accumulated in the electronic element, so that the electronic element will be over-heated and operate unstably. Even, the electronic device may crash. Since the working speed of the electronic elements is raised continuously, the electronic elements generate greater amount of heat than before. Therefore, heat-dissipating modules used for dissipating the heat generated by the electronic devices become more and more important.

Please refer to FIG. 1. A conventional heat-dissipating module 1 used in a notebook computer, a screen or a compact electronic device comprises a base 10, a plurality of heat pipes 11 and a heat-dissipating fin set 12. The base 10 has a raised portion 101 protruding from one surface of the base 10. The other surface of the base 10 abuts against a heat-generating element (such as a central processor). The raised portion 101 is provided with a plurality of semi-circular troughs 103 for receiving and fixing the heat pipes 11. Each of the heat pipes 11 has a heat-absorbing end 111 and a heat-releasing end 112. The heat-releasing end 112 is disposed through the heat-dissipating fin set 12. The heat-absorbing end 111 abuts tightly against the trough 103. By this arrangement, the heat generated by the heat-generating element can be first conducted to the base 10 and then to the heat-absorbing ends 111 and the heat-releasing ends 112 of the heat pipes 11. Finally, the heat is conducted from the heat-releasing ends 112 of the heat pipes 11 to the heat-dissipating fin set 12 connected thereto for rapid heat dissipation.

The conventional heat-dissipating module 1 really achieves a heat-dissipating effect, however, another problem arises. During the manufacturing of the heat-dissipating module 1, the base 10 and the raised portion 101 have to be made by a press-forming process, which consumes more materials for press-forming the base 10. Furthermore, since the raised portion 101 has to be made to protrude from the base 10 by the press-forming process, the manufacture of the heat-dissipating module 1 becomes more complicated with additional working steps. Further, the total thickness and weight of the base 10 plus the raised portion 101 are so increased that the finished heat-dissipating module 1 does not conform to the requirements for a lightweight design and has an increased cost.

According to the above, the conventional heat-dissipating module has drawbacks as follows: (1) increased cost; (2) uneasy to manufacture; and (3) unable to conform to the requirements for a lightweight design.

Therefore, it is an important issue for the present Inventor and manufacturers in this art to solve the problems of prior art.

SUMMARY

OF THE INVENTION

In order to solve the above problems, a primary objective of the present invention is to provide a heat-dissipating module, in which a base is integrally connected with at least one heat pipe, thereby reducing the cost.

Another objective of the present invention is to provide a heat-dissipating module, whereby the manufacturing procedure is simplified with fewer working steps.

A further objective of the present invention is to provide a heat-dissipating module which conforms to the requirements for a lightweight design.

A still further objective of the present invention is to provide a heat-dissipating module which has an excellent heat-dissipating effect.

In order to achieve the above objectives, the present invention provides a heat-dissipating module including: a base having a heat-absorbing surface and a heat-conducting surface opposite to the heat-absorbing surface; and at least one heat pipe having a heat-absorbing portion and a heat-dissipating portion, the heat-absorbing portion having a planar surface and a non-planar surface, the planar surface abutting against the heat-conducting surface to be integrally connected therewith, thereby forming the heat-dissipating module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a conventional heat-dissipating module;

FIG. 2 is a perspective view showing a heat-dissipating module according to a preferred embodiment of the present invention; and

FIG. 3 is a partial cross-sectional view showing the heat-dissipating module according to the preferred embodiment of the present invention.

DETAILED DESCRIPTION

OF THE INVENTION

The above-mentioned objectives, structural and functional features of the present invention will be described with reference to a preferred embodiment thereof and the accompanying drawings.

Please refer to FIGS. 2 and 3. The present invention is directed to a heat-dissipating module 2. In the present embodiment, the heat-dissipating module 2 includes a base 20 and at least one heat pipe 30. The base 10 has a heat-absorbing surface 201 and a heat-conducting surface 202 opposite to the heat-absorbing surface 201. The heat-absorbing surface 201 abuts tightly against a heat-generating element (such as a central processor), thereby absorbing the heat generated by the heat-generating element (not shown) and conducting the heat to the heat pipe 30 for heat dissipation.

The heat pipe 30 is connected onto the heat-conducting surface 202 of the base 20 and arranged thereon at intervals or adjacent to each other. In the present embodiment, the heat pipes 30 are arranged on the heat-conducting surface 202 at intervals. The heat pipe 30 has a heat-dissipating portion 301 and a heat-absorbing portion 303. The heat-absorbing portion 303 has a planar surface 3031 and a non-planar surface 3032. The planar surface 3031 abuts tightly against the heat-conducting surface 202 to be integrally connected thereto, thereby forming the heat-dissipating module 2. The planar surface 3031 and the non-planar surface 3032 define an accommodating space 3035. The accommodating space 3035 and the heat-absorbing portion 303 enclose a D shape or an arched shape as shown in FIG. 3.

A heat-dissipating space 32 is defined between each of the heat-absorbing portions 303, so that a working fluid flowing in the heat-dissipating space 32 can rapidly heat-exchange with the respective heat pipes 30, thereby increasing the heat-dissipating effect. Further, different auxiliary heat-dissipating performances can be predetermined in the heat-dissipating space 32 according to the user's demands. For example, the pitch between the heat pipes 30 may be adjusted and thus the width of the heat-dissipating space 32 is adjusted accordingly. That is to say, the width of the heat-dissipating space 32 may be smaller than, equal to or larger than the width of the heat pipes 30, thereby generating different auxiliary heat-dissipating performances.

Furthermore, since the planar surface 3031 of the heat-absorbing portion 303 of the heat pipe 30 abuts tightly against the heat-conducting surface 202 of the base 20 to be integrally connected therewith, the cost is reduced while the heat-dissipating effect is improved to an excellent extent. On the other hand, the manufacturing procedure is simplified with fewer working steps. Also, the base 20 can be made lightweight.

Please refer to FIG. 2 again. The heat-dissipating module 2 further comprises a heat sink 4 having a plurality of heat-dissipating fins 41. The heat-dissipating portions 301 of the heat pipe 30 are disposed through the heat-dissipating fins 41 to be integrally connected therewith.

According to the above, in comparison with prior art, the present invention has advantages effects as follows: (1) reduced cost; (2) simplified manufacturing process with fewer working steps; (3) excellent heat-dissipating effect; and (4) light in weight.

Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.



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stats Patent Info
Application #
US 20120043057 A1
Publish Date
02/23/2012
Document #
12859540
File Date
08/19/2010
USPTO Class
16510426
Other USPTO Classes
International Class
28D15/04
Drawings
4


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Heat Exchange   Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat   Liquid Fluent Heat Exchange Material   Utilizing Change Of State   Utilizing Capillary Attraction