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Silicon tab edge mount for a wafer level package

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Title: Silicon tab edge mount for a wafer level package.
Abstract: A Micro-ElectroMechanical Systems (MEMS) device having electrical connections (a metallization pattern) available at an edge of the MEMS die. The metallization pattern on the edge of the die allows the die to be mounted on edge with no further packaging, if desired. ...


Browse recent Honeywell International Inc. patents - Morristown, NJ, US
Inventor: Mark Eskridge
USPTO Applicaton #: #20110108935 - Class: 257417 (USPTO) - 05/12/11 - Class 257 
Active Solid-state Devices (e.g., Transistors, Solid-state Diodes) > Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) >Physical Deformation >Strain Sensors

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The Patent Description & Claims data below is from USPTO Patent Application 20110108935, Silicon tab edge mount for a wafer level package.

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BACKGROUND OF THE INVENTION

In order for a Micro-ElectroMechanical Systems (MEMS) sensor to be useful, it must be electrically connected to a system capable of interpreting its signals. It must also be mechanically mounted to the system, either directly or through an intermediate “electronics package” into which it is placed.

Most MEMS dies are laid out with electrical connections on one side (“top”) and mechanical connections on the other (“bottom”). In some cases, the electrical and mechanical attachments to the next level of the system are the same. This is known as “flip chip” die attach. The die is attached to the system on its face or back. A number of possible scenarios using wirebonding, various epoxies, solders, and direct attachments can be used to package the MEMS die in these orientations.

Sometimes it is desirable to mount MEMS sensors on one “edge” of the die. This can be because: The die senses acceleration or rotation (accelerometer or gyro) and all three axes of motion are required for the system; Mounting stress on the edge of the die is better for performance than on the top or bottom; Heat from the system is best applied to a die edge for a performance reason; and The system has geometric requirements for this configuration (space savings).

It is also often important when packaging MEMS into a system to make it as small as possible, avoiding secondary packaging where possible to reduce size, mass, and cost.

SUMMARY

OF THE INVENTION

The present invention provides a Micro-ElectroMechanical Systems (MEMS) device having electrical connections (a metallization pattern) available at an edge of the MEMS die. The metallization pattern on the edge of the die allows the die to be mounted on edge with no further packaging, if desired.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred and alternative embodiments of the present invention are described in detail below with reference to the following drawings:

FIG. 1 is an x-ray perspective view of a MEMS die formed in accordance with an embodiment with the present invention;

FIG. 2 is a partial perspective view of the MEMS die shown in FIG. 1;

FIG. 3 is a partial side view of the MEMS die shown in FIG. 1;

FIG. 4 is a perspective view of the MEMS die shown in FIG. 1; and

FIG. 5 is a perspective view of a system with a MEMS die formed in accordance with an embodiment with the present invention mounted thereon.



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stats Patent Info
Application #
US 20110108935 A1
Publish Date
05/12/2011
Document #
12615188
File Date
11/09/2009
USPTO Class
257417
Other USPTO Classes
257E29324, 257678
International Class
01L29/84
Drawings
6



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