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10/29/09 - USPTO Class 310 |  17 views | #20090267453 | Prev - Next | About this Page  310 rss/xml feed  monitor keywords

Bulk acoustic wave resonator with controlled thickness region having controlled electromechanical coupling

USPTO Application #: 20090267453
Title: Bulk acoustic wave resonator with controlled thickness region having controlled electromechanical coupling
Abstract: According to an exemplary embodiment, a bulk acoustic wave (BAW) resonator includes a piezoelectric layer situated between upper and lower electrodes, where each of the upper and lower electrodes are a high density metal. The BAW resonator further includes a controlled thickness region including a low density metal segment, where the low density metal segment is situated adjacent to the piezoelectric layer, and where the controlled thickness region has controlled electromechanical coupling. The controlled thickness region can provide reduced electromechanical coupling into lateral modes. The low density metal segment can extend along the perimeter of the BAW resonator. (end of abstract)



Agent: Lando & Anastasi, LLP S2059 - Cambridge, MA, US
Inventors: Bradley P. Barber, Bradley P. Barber, Frank Bi, Frank Bi, Craig E. Carpenter, Craig E. Carpenter
USPTO Applicaton #: 20090267453 - Class: 310322 (USPTO)

Bulk acoustic wave resonator with controlled thickness region having controlled electromechanical coupling description/claims


The Patent Description & Claims data below is from USPTO Patent Application 20090267453, Bulk acoustic wave resonator with controlled thickness region having controlled electromechanical coupling.

Brief Patent Description - Full Patent Description - Patent Application Claims
  monitor keywords BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to the field of electronics. More particularly, the invention relates to bulk acoustic wave (BAW) resonators.

2. Background Art

Because of their small footprint, low profile, and high performance, bulk acoustic wave (BAW) filters are increasingly utilized to provide radio frequency (RF) filtering in mobile electronic devices, such as cellular phones, as well as other types of electronic devices. BAW filters can include a number of BAW resonators, where each BAW resonator typically includes a layer of piezoelectric material, such as aluminum nitride, sandwiched between upper and lower electrodes. When an electric field is applied across the upper and lower electrodes of the BAW resonator, the electric field can cause the layer of piezoelectric material to vibrate. As a result, the piezoelectric material can generate a number of allowed modes of acoustic wave propagation, which include a desired longitudinal mode. However, unwanted excitation of energy in modes of wave propagation that have high energy loss, such as lateral modes, can cause a significant loss of energy in a BAW resonator and, thereby, undesirably lower the BAW resonator\'s quality factor (Q).

Conventional approaches to reducing energy loss in a BAW resonator include shaping the profile of the resonator such that the energy is best contained and controlled in a desired longitudinal mode. In one conventional profile shaping approach, a shaped region can be provided close to the edge of the BAW resonator, which is a region of high energy loss, to reduce the amount of energy that is excited in lossy modes of wave propagation in the BAW resonator. However, the shaped region provided in this conventional approach can also introduce additional unwanted modes, such as lateral modes contained within the shaped region, which can cause energy loss in the BAW resonator.

SUMMARY OF THE INVENTION

A bulk acoustic wave resonator with controlled thickness region having controlled electromechanical coupling, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a cross-sectional view of an exemplary bulk acoustic wave (BAW) resonator, in accordance with one embodiment of the present invention.

FIG. 1B illustrates a top view of the exemplary BAW resonator of FIG. 1A.

FIG. 2A illustrates a cross-sectional view of an exemplary BAW resonator, in accordance with one embodiment of the present invention.

FIG. 2B illustrates a top view of the exemplary BAW resonator of FIG. 2A.

FIG. 3 is a flowchart illustrating an exemplary method for fabricating a BAW resonator in accordance with one embodiment of the present invention.

FIG. 4 is a diagram of an exemplary electronic system including an exemplary chip or die utilizing a BAW resonator in accordance with one embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed to a bulk acoustic wave resonator with controlled thickness region having controlled electromechanical coupling. The following description contains specific information pertaining to the implementation of the present invention. One skilled in the art will recognize that the present invention may be implemented in a manner different from that specifically discussed in the present application. Moreover, some of the specific details of the invention are not discussed in order not to obscure the invention. The specific details not described in the present application are within the knowledge of a person of ordinary skill in the art.



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