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Heat dissipation device having an improved fin structureHeat dissipation device having an improved fin structure description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20090260779, Heat dissipation device having an improved fin structure. Brief Patent Description - Full Patent Description - Patent Application Claims
1. Field of the Invention The present invention relates generally to a heat sink, and more particularly to a heat sink having a plurality of fins to remove heat from an electronic heat-generating component, wherein the fins have an improved structure. 2. Description of Related Art Heat sinks are usually used to remove heat from electronic heat-generating components, such as central processing units (CPUs) etc., to keep the components in stable operation. A typical heat sink comprises a base for contacting with the heat-generating component to absorb the heat of the heat-generating component and a plurality of parallel planar fins attached to the base by soldering or adhering. The fins are used for dissipating the heat to ambient air. For enhancing heat dissipation efficiency, a fan is usually mounted on a top or a side of the heat sink to impel air to flow between the fins. To meet a requirement of heat removal from the heat-generating component which generates more and more heat, it is current way to enlarge the total outer area of the fins by increasing the number of the fins or enlarging a dimension of each fin. However, such thermal resolutions have their limitations. Because a space in a computer enclosure is crowded by various components and the space available for the heat sink cannot be readily increased, an increase of the size of the fins is not feasible. Furthermore, the larger number the fins have, the denser the fins are, and further the narrower the channels between the fins are. If the air channels are too narrow, the air cannot smoothly flow through the channels, which impedes the heat dissipation of the heat sink even if the number of the fins is increased. What is needed is a heat sink in which has a great heat dissipating efficiency by means of improving heat exchange between the fins and air flowing through the heat sink under a condition that the size and number of the fins are not necessary to be increased. The present invention relates to a heat dissipation device for dissipating heat from a heat-generating electronic element. The heat dissipation device includes a base plate adapted for absorbing heat from the heat-generating component, a fin unit located above the base plate and having a plurality of fins stacked together. Each of the fins has a plurality of parallel and protruding flanges on a top surface thereof. At least a heat pipe has an evaporating section thermally engaging in the base plate and a pair of condensing sections extending through the fins. The protruding flanges of the fins are of equal height and parallel to opposite short sides of the fins. A length of each of the protruding flanges is equal to that of the short sides of the fin. The protruding flanges increase heat dissipation area of the fin unit, thereby increasing heat dissipating effectiveness of the heat dissipation device. Other advantages and novel features will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings, in which: Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiment. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. Continue reading about Heat dissipation device having an improved fin structure... Full patent description for Heat dissipation device having an improved fin structure Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Heat dissipation device having an improved fin structure patent application. Patent Applications in related categories: 20090288807 - Blowerless heat exchanger based on micro-jet entrainment - A blowerless heat exchanger apparatus based on micro-jet entrainment is disclosed. The heat exchanger apparatus incorporates a number of fins regularly spaced apart from each other and parallel to each other, thus letting air currents flow in the space defined between them. A dense array of micro-jet nozzles can be ... 20090288806 - Heat radiating unit - A heat radiating unit in the form of a heat sink includes a contact section arranged on a central portion of an end face of the heat sink for contacting with a heat source, and having more than one extension plate outward extended therefrom; a first heat-dissipating section composed of ... ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Heat dissipation device having an improved fin structure or other areas of interest. ### Previous Patent Application: case and rack system for liquid submersion cooling of electronic devices connected in an array Next Patent Application: Low profile heat sink for semiconductor devices Industry Class: Heat exchange ### FreshPatents.com Support Thank you for viewing the Heat dissipation device having an improved fin structure patent info. IP-related news and info Results in 2.36783 seconds Other interesting Feshpatents.com categories: Accenture , Agouron Pharmaceuticals , Amgen , AT&T , Bausch & Lomb , Callaway Golf paws |
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