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Circuit board, semiconductor device, and manufacturing method of circuit boardCircuit board, semiconductor device, and manufacturing method of circuit board description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20090174062, Circuit board, semiconductor device, and manufacturing method of circuit board. Brief Patent Description - Full Patent Description - Patent Application Claims
The present application is a Divisional application of U.S. application Ser. No. 11/645,044 filed Dec. 22, 2006, which is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2005-378530, filed Dec. 28, 2005, the entire contents of which are incorporated herein by reference. 1. Field of the Invention This invention relates to a circuit board, a semiconductor device, and a manufacturing method of the circuit board. 2. Description of the Related Art A chip scale package (CSP) has been known as a mounting structure of an electronic equipment suitable for the size reduction of the electronic equipment. The CSP has a structure in which a semiconductor chip is bonded face down to a substrate having substantially the same area as the semiconductor chip, generally a relay substrate called an interposer and in which the semiconductor chip is connected to a printed wiring board via wiring lines and via holes provided in the interposer. Jpn. Pat. Appln. KOKAI Publication No. 2001-326305 discloses a representative CSP. In this prior art document, the substrate of the interposer is made of silicon. Since the silicon substrate is used, both surfaces of the substrate can be smoothed by polishing the substrate, and micropatterns can be easily formed, and moreover, flexure and bending can be held down even if the thickness of the substrate is reduced. An upper wiring line and a lower wiring line are respectively provided on the upper surface and lower surface of the silicon substrate. The upper wiring line is connected to the corresponding lower wiring line via a cylindrical vertical conductor provided in the inner wall surface of a through hole formed in the silicon substrate. Solder balls are provided under connection pad portions of the lower wiring line. In the conventional semiconductor device, pads provided on the lower surface of the semiconductor chip are bonded to the connection pad portions of the lower wiring line of the interposer such that the semiconductor chip is installed on the interposer, and the solder balls of the interposer are bonded to connection terminals on the printed wiring board such that the semiconductor chip is mounted on the printed wiring board via the interposer. In the conventional semiconductor device, since the vertical conductor of the interposer is cylindrical, a solder ball can not be provided in the lower part of this cylindrical vertical conductor. Thus, the solder balls are provided under the connection pad portions of the lower wiring line connected to the vertical conductor, and because a region is required to dispose the lower wiring line, there is a problem that the area of the interposer is increased and the whole semiconductor device is thus increased in size. It is therefore an object of this invention to provide a circuit board, a semiconductor device and a manufacturing method of the circuit board which enables a size reduction. According to one aspect of this invention, there is provided a circuit board comprising: a semiconductor substrate which includes a plurality of through holes passing from an upper surface to a lower surface thereof; and a plurality of wiring lines which are provided on the upper surface of the semiconductor substrate and which have bottomed cylindrical portions located in regions corresponding to the through holes, wherein bottom surfaces of the bottomed cylindrical portions of the wiring lines serve as connection pad portions. According to this invention, since the bottom surfaces of the bottomed cylindrical portions of the wiring lines formed within the regions corresponding to the through holes of the semiconductor substrate serve as the connection pad portions, it is not necessary to provide a lower wiring line having a connection pad portion under the semiconductor substrate, and the area of the semiconductor substrate can be reduced accordingly, and moreover, a size reduction can be achieved. Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter. The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention. Continue reading about Circuit board, semiconductor device, and manufacturing method of circuit board... Full patent description for Circuit board, semiconductor device, and manufacturing method of circuit board Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Circuit board, semiconductor device, and manufacturing method of circuit board patent application. Patent Applications in related categories: 20090283898 - Disabling electrical connections using pass-through 3d interconnects and associated systems and methods - Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated ... 20090283899 - Semiconductor device - According to one embodiment of the present invention, a semiconductor device is provided, that includes a semiconductor carrier; a cavity formed within the semiconductor carrier, the cavity extending from the top surface of the semiconductor carrier into the semiconductor carrier; and at least one semiconductor chip provided within the cavity. ... 20090283900 - Semiconductor device and manufacturing method for semiconductor device - A semiconductor device comprises: (a) a wiring board having front surface lands disposed on a front surface and rear surface lands disposed on a rear surface; (b) a semiconductor chip formed with an integrated circuit and electrode terminals electrically connected to the integrated circuit; and (c) a sealing resin that ... ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Circuit board, semiconductor device, and manufacturing method of circuit board or other areas of interest. ### Previous Patent Application: Method and manufacture of silicon based package and devices manufactured thereby Next Patent Application: Hybrid integrated circuit device, and method for fabricating the same, and electronic device Industry Class: Active solid-state devices (e.g., transistors, solid-state diodes) ### FreshPatents.com Support Thank you for viewing the Circuit board, semiconductor device, and manufacturing method of circuit board patent info. IP-related news and info Results in 2.551 seconds Other interesting Feshpatents.com categories: Qualcomm , Schering-Plough , Schlumberger , Seagate , Siemens , Texas Instruments , paws |
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