Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same

This application is based upon and claims the benefit of priority from the prior Japanese Patent Applications No. 2007-335819, filed Dec. 27, 2007, and Japanese Patent Application No. 2008-091664, filed Mar. 31, 2008, the entire contents of which are incorporated herein by reference.

1. Field of the Invention

The present invention relates to a substrate for mounting a device and a method for producing the same, a semiconductor module and a method for producing the same, and a portable apparatus provided with the same.

2. Description of the Related Art

Amid the acceleration of high performance of portable electronic apparatuses such as portable phone, PDA, DVC, and DSC, in order to be accepted in the market, it is essential that such products are miniaturized and reduced in their weight. Hence, there is also a demand for miniaturization of semiconductor modules such as multi-chip module (MCM) or the like used in these electronic apparatuses. With respect to the demand, a semiconductor device is known in which an active device such as a semiconductor chip, and a passive device such as a capacitor, are covered by an insulating layer formed on a substrate, and the active device and the passive device are connected to a wiring on the insulating layer via the insulating layer. In recent years, with miniaturization and high performance of electronic apparatuses, there is a demand for further miniaturization of semiconductor devices used in the electronic apparatuses. With miniaturization of semiconductor devices, it is essential to narrow a pitch between electrodes for being implemented on a printed wiring board. As a surface-mounting method of a semiconductor device, a flip-chip mounting method is known in which a solder bump is formed on an electrode of the semiconductor device, and the solder bump and an electrode pad of a printed wiring board are soldered. However, in the flip-chip mounting method, there are limitations in narrowing the pitch between electrodes, because of restrictions resulting from the size of the solder bump itself and occurrence of bridges while soldering, or the like. As a structure for overcoming these restrictions, a structure is known in which a projected structure formed on a substrate is used as an electrode or a via, and a semiconductor device is mounted on the substrate via an insulating resin such as an epoxy resin, such that an electrode of the semiconductor device is connected to the projected structure.

However, in the conventional semiconductor devices, there are problems that miniaturization of a semiconductor module is suppressed and the number of the production processes is increased, because a passive device such as a capacitor or the like is mounted on a silicon substrate as a separate part. Further, in the structure in which a wiring layer of a substrate for mounting a device and a semiconductor device are made into one body via an insulating resin, such that a projected structure provided on the wiring layer and an electrode of the semiconductor device are connected, adhesion between the insulating resin and the semiconductor device is not high. Therefore, there is a fear that the insulating resin could peel from the semiconductor device by a thermal stress generated due to, for example, a change in temperature of the environment. In particular, in the case where an interval between the projected structures penetrating the insulating resin is large, as is in the conventional structure stated above, the insulating resin is easy to peel from the semiconductor device between the projected structures. And, in the case where the insulating resin peels from the semiconductor device, adhesion between the projected structure and the semiconductor device is decreased; and as a result, there is a fear that the connection reliability between the projected structure and the semiconductor device is decreased.

The present invention has been made in view of these situations, and a general purpose of the invention is to provide a technique in which further miniaturization of a semiconductor module can be achieved as well as reduction in the number of the production processes. Another purpose of the invention is to provide a technique in which the connection reliability between a projected structure and an electrode of a semiconductor device can be improved in the structure in which the two are connected to each other.

In order to solve the above-mentioned problems, an embodiment of the present invention is a substrate for mounting a device. The substrate for mounting a device comprises: an insulating resin layer; a wiring layer provided on one major surface of the insulating resin layer; a projected electrode that is connected to the wiring layer electrically and that projects toward the insulating resin layer from the wiring layer; and a metal member at least part of which is embedded in the insulating resin layer, wherein an embedded depth of the metal member is shallower than a projected length of the projected electrode.

In order to solve the above-mentioned problems, an embodiment of the present invention is a substrate for mounting a device. The substrate for mounting a device comprises: an insulating resin layer formed by an insulating resin; a wiring layer provided on one major surface of the insulating resin layer; a plurality of projected electrodes that are connected to the wiring layer electrically, and that project toward the insulating resin layer from the wiring layer; and a counter electrode that is provided at a position corresponding to each of the plurality of projected electrodes, on the other major surface of the insulating resin layer, and that has a counterface facing the top face of the projected electrode, wherein, among the plurality of projected electrodes, a projected length of part of the plurality of projected electrodes is smaller than that of the other projected electrodes, and wherein the part of the plurality of projected electrodes and the counter electrodes corresponding thereto are capacitively-coupled, and wherein the other projected electrodes and the counter electrodes corresponding thereto are connected electrically.

Still another embodiment of the present invention is a method for producing a substrate for mounting a device. The method for producing a substrate for mounting a device comprises: preparing a metal plate on which a plurality of projected electrodes are provided so as to project; adjusting, among the plurality of projected electrodes, a projected length of part of the plurality of projected electrodes so as to be smaller than that of the other projected electrodes; connecting the part of projected electrodes and the counter electrodes corresponding thereto in a way that the two are capacitively-coupled, and connecting the other projected electrodes and the counter electrodes corresponding thereto in a way that the two are connected electrically, after the metal plate is arranged on one major surface of the insulating resin layer such that the projected electrodes face the insulating resin layer side, while the other projected electrodes are exposed from the other major surface of the insulating resin layer, and a counter electrode having a counterface that faces the top face of the projected electrode is arranged at a position corresponding to each of the plurality of projected electrodes, on the other major surface the insulating resin layer; and removing selectively the metal plate to form the wiring layer.

Still another embodiment of the present invention is a method for producing a semiconductor module. The method for producing a semiconductor module comprises mounting a semiconductor device on the substrate for mounting a device produced by the method for producing a substrate for mounting a device according to any one of embodiments stated above.

Still another embodiment of the present invention is also a method for producing a semiconductor module. The method for producing a semiconductor module comprises: preparing a metal plate on which a plurality of projected electrodes are provided so as to project; adjusting, among the plurality of projected electrodes, a projected length of part of the plurality of projected electrodes so as to be smaller than that of the other projected electrodes; connecting the part of the projected electrodes and device electrodes corresponding thereto in a way that the two are capatively-coupled, and connecting the other projected electrodes and the device electrodes corresponding thereto in a way that the two are connected electrically, after the metal plate is arranged on one major surface of the insulating layer such that the projected electrodes face the insulating resin layer side, while the other projected electrodes are exposed from the other major surface of the insulating resin layer, and a semiconductor device provided with the device electrode corresponding to the projected electrode is arranged on the other major surface of the insulating resin layer; and removing selectively the metal plate to form the wiring layer.

In order to solve the above-mentioned problems, an embodiment of the present invention is a substrate for mounting a device. The substrate for mounting a device comprises: an insulating resin layer; a wiring layer provided on one major surface of the insulating resin layer; a projected electrode that is connected to the wiring layer electrically and projects toward the insulating resin layer from the wiring layer; and a backing member at least part of which is embedded in the insulating resin layer, and that is used for backing up the insulating resin layer.

Other embodiment of the present invention is a semiconductor module. The semiconductor module comprises: the substrate for mounting a device according to any one of embodiments stated above; and a semiconductor device provided with a device electrode facing the projected electrode, wherein the projected electrode penetrates the insulating resin layer to be connected to the device electrode electrically.

Still another embodiment of the present invention is a portable apparatus. On the portable apparatus, the semiconductor module according to any one of embodiments stated above is mounted.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional diagram illustrating a structure of a substrate for mounting a device and a semiconductor module according to Embodiment 1;

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