Cooling systems and heat exchangers for cooling computer components

The present disclosure relates generally to cooling systems and heat exchangers for cooling electronic components in computer systems.

Supercomputers and other large computer systems typically include a large number of computer modules housed in cabinets arranged in banks. The computer modules are typically positioned in close proximity to each other. During operation, the close proximity can make dissipating heat generated by the modules difficult. If not dissipated, the heat can damage the modules or significantly reduce system performance.

One conventional technique for computer module cooling includes drawing air into the cabinet to cool the computer modules and discharging the heated air to the room. One shortcoming of this technique, however, is that the heat capacity of the cooling air can quickly become saturated. As a result, some of the computer modules may not be adequately cooled. Accordingly, there is a need to effectively dissipate heat generated by computer modules during operation.

The following disclosure describes several embodiments of cooling systems for use with supercomputers and/or other computer systems. Persons of ordinary skill in the art will understand, however, that the invention can have other embodiments with additional features, or without several of the features shown and described below with reference to FIGS. 1-5. In the Figures, identical reference numbers identify structurally and/or functionally identical, or at least generally similar, elements.

FIG. 1A is a partially schematic elevation view of a computer system 100 having a plurality of internal heat exchangers 118 (identified individually as heat exchangers 118a-d) configured in accordance with an embodiment of the invention. The computer system 100 can include a computer cabinet 102 in a room 101. Working fluid lines 106 (identified individually as a supply line 106a and a return line 106b) connect the computer cabinet 102 to a heat removal system 104. In the illustrated embodiment, the heat removal system 104 is situated in the room 101 and spaced apart from the computer cabinet 102. In other embodiments, however, the heat removal system 104 can be integrated into the computer cabinet 102, positioned outside the room 101, or situated in other suitable places.

The computer cabinet 102 can include an air inlet 114 for receiving cooling air from the room 101 or a floor plenum (not shown), an air outlet 116 for discharging air to the room 101, and a plurality of computer module compartments 120 (identified individually as first, second, and third computer module compartments 120a-c, respectively) arranged vertically between the air inlet 114 and the air outlet 116 in a chassis 110. Individual computer module compartments 120 hold a plurality of computer modules 112 oriented edgewise with respect to the flow of cooling air through the chassis 110.