Heat-dissipating unit

1. Field of the Invention

The present invention relates to a heat-dissipating unit and, more particularly, to application of a thermally conductive board highly efficient in heat transfer.

2. Description of the Prior Art

Owing to rapid development of industrial sectors, such as information, communication, and optoelectronics, in recent years, the trend of electronic products is toward high levels and miniaturization. Given the demand for high-speed, high-frequency, and miniaturized electronic products, electronic components nowadays feature increasingly high heat-generation density. Hence, cooling efficiency has become an important factor in the stability of electronic products. Highly efficient in heat transfer, heat pipes and heat spreaders are thermally conductive components in wide use with electronic products. A heat pipe or a heat spreader comprises a sealed vacuum copper pipe or plate, wherein a capillary layer is sintered to the inner wall of the copper pipe or plate. A working fluid inside the copper pipe or plate is exposed to a heat source (for example, CPU) at the evaporator end and vaporizes as a result. The vapor from the heated end ends up releasing heat at the condenser end (for example, heat-dissipating fins, and a fan) and thereby condensing into liquid. The liquid returns to the evaporator end due to capillary action of the capillary layer, thereby providing closed circulation.

Referring to FIG. 1, which is a perspective view of a conventional heat-dissipating module, a heat-dissipating module 1 comprises a heat-dissipating fin set 11 and a heat pipe 12. The heat-dissipating fin set 11 is formed with at least one through hole 112. The bottom of the heat-dissipating fin set 11 is coupled to a base 111 and gains access to a heat-generating source 13 via the base 111. The heat pipe 12 penetrates the through hole 112 of the heat-dissipating fin set 11 and is coupled to the base 111. Heat generated by the heat-generating source 13 is transferred to the heat pipe 12 via the base 111. Afterward, the heat pipe 12 transfers the heat to the heat-dissipating fin set 11 for heat dissipation.

Nevertheless, the prior art illustrated with the heat-dissipating module 1 is not free of any drawbacks. The heat pipe 12 has to be coupled to the heat-dissipating fin set 11 before being coupled to the base 111, otherwise the base 111 cannot come into immediate contact with the heat-generating source 13, and the heat from the heat-generating source 13 cannot be transferred to the heat pipe 12 and dissipated at a remote end. The heat pipe 12 is not in immediate contact with the heat-generating source 13; instead, the heat pipe 12 has to be coupled to the base 111, because the base 111 is indispensable to heat transfer, and the heat pipe 12 cannot work without the base 111. A gap is likely to appear between the heat pipe 12 and the base 111 despite firm adhesion or thermal grease therebetween, resulting in thermal resistance and great reduction of heat transfer.

Another conventional heat-dissipating module comprises a thermally conductive board for heat dissipation. The thermally conductive board is usually for use with a notebook computer or a compact device that requires heat dissipation. The thermally conductive board comprises two superimposed metal plates and is inwardly formed with channels and/or a capillary structure carrying a working fluid. The working fluid is exposed to a heat source (for example, CPU) at the evaporator end and vaporizes as a result. The vapor from the heated end ends up releasing heat at the condenser end (for example, heat-dissipating fins, and a fan) and thereby condensing into liquid. The liquid returns to the evaporator end due to capillary action of the capillary structure. However, the thermally conductive board has a drawback, that is, a short path from the evaporator end to the condenser end, which accounts for inefficient heat dissipation of the thermally conductive board.

Hence, the drawbacks of the prior art are as follows:

• • 1. The coupling of the heat pipe and the base is compromised by a gap likely to appear therebetween, resulting in thermal resistance.
  • 2. Bulky and space-consuming.
  • 3. Inefficient heat dissipation.

Accordingly, the inventor of this patent application and related manufacturers need urgent solution to overcome the drawbacks of the aforementioned prior art.

Accordingly, to solve the drawbacks of the aforementioned prior art, it is a primary objective of the present invention to provide a heat-dissipating unit in immediate contact with a heat-generating source, capable of heat transfer, and comprising a branch portion extending outward from the body of the heat-dissipating unit, thereby transferring heat to a remote end for heat dissipation.

Another objective of the present invention is to provide a heat-dissipating unit that is space-saving.