Cooling apparatus

1. Field of the Invention

The present invention relates to a cooling apparatus. In particular, this invention relates to a cooling apparatus that its heat pipes are stacked and heat conducting columns are disposed between the heat pipes so that the heat conducting area is increased.

2. Description of the Related Art

When electric machines or electronic devices are operating, the electronic components often generate a substantial amount of heat. The heat needs to be dissipated so that the electronic components are assured to operate normally and do not suffer damage due to an excessive operating temperature. In case of the CPU in a computer, the processing speed is very high and a lot of heat is generated, which needs to be rapidly dissipated to make the computer operate normally. Therefore, electric machines or electronic devices often have a cooling apparatus to dissipate the heat generated by the electronic components.

The cooling apparatus of the prior art includes a heat conducting block, a cooler and a plurality of heat pipes. The heat-absorbing terminal and the condensing terminal of the heat pipes are respectively connected with the heat conducting block and the cooler. The heat conducting block is located on the electronic components to absorb the heat generated therefrom. The heat is delivered to the cooler to be dissipated via the heat pipes so that the cooling effect is achieved.

However, because the dimension of the base of the cooling apparatus is small, the quantity of the heat pipes that can be disposed on the base is few. The cooling efficiency is inadequate when the operation speed of the electronic components increases.

One particular aspect of the present invention is to provide a cooling apparatus of which the heat conducting area is increased with respect to its base area so that the cooling efficiency of the cooling apparatus is enhanced.

The cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base at fixed intervals. Each of the second heat pipes has a heat-absorbing terminal. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes at fixed intervals. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes. One end of the first heat conducting column contacts the base, and the second end of the first heat conducting column contacts the heat-absorbing terminal of the second cooling pipe. Each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes, and one end of the second heat conducting column contacts the heat-absorbing terminal of the first cooling pipe.

In another embodiment, the cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base in order. Each of the second heat pipes has a heat-absorbing terminal. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes in order. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes, and one end of the first heat conducting column contacts the heat-absorbing terminal of the second cooling pipe. Each of the second heat conducting columns includes a first portion and a second portion. The second portion and the first portion are oppositely installed between the heat-absorbing terminals of the two adjacent second heat pipes.

The present invention has the following characteristics. Because the heat pipes of the cooling apparatus are stacked, the quantity of the heat pipes is not limited by the dimension of the base and can be increased. Furthermore, a plurality of heat conducting columns is installed between the heat pipes so that the heat conducting area is increased. Thereby, the heat generated from the electronic components can be rapidly delivered to the cooler.

For further understanding of the invention, reference is made to the following detailed description illustrating the embodiments and examples of the invention. The description is only for illustrating the invention and is not intended to limit of the scope of the claim.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings included herein provide a further understanding of the invention. A brief introduction of the drawings is as follows:

FIG. 1 is an exploded perspective view of the cooling apparatus of the first embodiment of the present invention;

FIG. 2 is an assembly perspective view of the cooling apparatus of the first embodiment of the present invention;

FIG. 3 is a cross-sectional view of the cooling apparatus of the first embodiment of the present invention;

FIG. 4 is a cross-sectional view of the cooling apparatus of the second embodiment of the present invention;

FIG. 5 is a cross-sectional view of the cooling apparatus of the third embodiment of the present invention;

Continue reading about Cooling apparatus...
Full patent description for Cooling apparatus

Brief Patent Description - Full Patent Description - Patent Application Claims

Click on the above for other options relating to this Cooling apparatus patent application.

Patent Applications in related categories:

20090283243 - Heat dissipation device - A securing structure of a heat dissipation device for an electronic component includes a fastener and a securing arm. The fastener includes a bolt and a spring surrounding the bolt. The bolt includes a main portion, a bottom fixing portion and a top head portion. An aperture extends inwardly from ...


###


How KEYWORD MONITOR works... a FREE service from FreshPatents
1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored.
3. Each week you receive an email with patent applications related to your keywords.  
Start now! - Receive info on patent apps like Cooling apparatus or other areas of interest.
###


Previous Patent Application:
High performance compliant thermal interface cooling structures
Next Patent Application:
Fin and heat sink
Industry Class:
Heat exchange

###

Design/code © 2009 FreshContext LLC/Freshpatents.com. Website Terms and Conditions - Also read: About this Page
Patent data source: patents published by the United States Patent and Trademark Office (USPTO)
Information published here is for research/educational purposes only (and in conjunction with our Keyword Monitor) and is not meant to be used in place of the full USPTO patent document/images or a comprehensive patent archive search. Complete official applications are on file at the USPTO and often contain additional data/images (Freshpatents is currently text-only). FreshPatents.com is not affiliated with or endorsed by the USPTO or firms/individuals or products/designs/ideas related to listed patents.

FreshPatents.com Support
Thank you for viewing the Cooling apparatus patent info.
IP-related news and info


Results in 2.27441 seconds


Other interesting Feshpatents.com categories:
Canon USA , Celera Genomics , Cephalon, Inc. , Cingular Wireless , Clorox , Colgate-Palmolive , Corning , Cymer , paws