| Copper tin nickel phosphorus alloys with improved strength and formability and method of making same -> Monitor Keywords |
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Copper tin nickel phosphorus alloys with improved strength and formability and method of making sameCopper tin nickel phosphorus alloys with improved strength and formability and method of making same description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20090098011, Copper tin nickel phosphorus alloys with improved strength and formability and method of making same. Brief Patent Description - Full Patent Description - Patent Application Claims
This application claims priority to U.S. Provisional Patent Application Ser. No. 60/979,064, filed Oct. 10, 2007, the entire disclosure of which is incorporated herein. This invention relates to copper alloys, and in particular to copper-tin-nickel-phosphorus alloys with improved strength and formability. There is a continued need for high strength copper alloys of good formability and reasonable cost for use in electrical connectors, and in particular for use in automotive electrical connectors. Current connector alloys in the low cost Cu—Sn—Ni—P family lack the combination of properties of practical strength (77 KSI), intermediate conductivity (37% IACS), excellent formability, and decent stress relaxation (65% at 150° C.). Formability in the document is measured by forming a strip by roller bending it 90° about a die of known radii. The ratio of the smallest die radii that the strip can be formed without cracking is divided over the strip thickness. Bends were measured both parallel (bad way, BW) and perpendicular (good way, GW) to the direction of rolling. Table 1 shows currently available Cu—Sn—Ni—P alloys:
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